Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
• NASA approved, low outgassing epoxy
• Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
• Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging
o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
o Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays